产品展示
| 封装 | 概述 | 咨询 |
| SOD-123 | Features: 1. Low power dissipation and fast swtiching (TRR<50nS) 2. General SMD packaging devices 3. Complies with IPC/JEDEC J-STD-033C MSD Level 3 4. UL Flammability Classification Rating 94V-0 5. Multiple voltage & current options for different applications Application: Electronic products, Automotive industries, Munitions, Telecommunications, Aerospace industries, and Intelligent control systems, testing equipments , consumption products , and power supply etc. | 具体详情请咨询我司 |
| SOD-323 | Features: 1. Low power dissipation and fast swtiching (TRR<50nS) 2. General SMD packaging devices 3. Complies with IPC/JEDEC J-STD-033C MSD Level 3 4. UL Flammability Classification Rating 94V-0 5. Multiple voltage & current options for different applications Application: Electronic products, Automotive industries, Munitions, Telecommunications, Aerospace industries, and Intelligent control systems, testing equipments , consumption products , and power supply etc. | 具体详情请咨询我司 |
| SOD-523 | Features: 1. Low power dissipation and fast swtiching (TRR<50nS) 2. General SMD packaging devices 3. Complies with IPC/JEDEC J-STD-033C MSD Level 3 4. UL Flammability Classification Rating 94V-0 5. Multiple voltage & current options for different applications Application: Electronic products, Automotive industries, Munitions, Telecommunications, Aerospace industries, and Intelligent control systems, testing equipments , consumption products , and power supply etc. | 具体详情请咨询我司 |
| SOT-23 | Features: 1. Small pattern package is to reduce PCB's layout space 2. General SMD packaging devicesn 3. Complies with IPC/JEDEC J-STD-033C MSD Level 3 4. UL Flammability Classification Rating 94V-0 5. Multiple performance options for different applications Application: Electronic products, Automotive industries, Munitions, Telecommunications, Aerospace industries, and Intelligent control systems, testing equipments , consumption products , and power supply etc. | 具体详情请咨询我司 |
| SOT-323 | Features: 1. Small pattern package is to reduce PCB's layout space 2. General SMD packaging devicesn 3. Complies with IPC/JEDEC J-STD-033C MSD Level 3 4. UL Flammability Classification Rating 94V-0 5. Multiple performance options for different applications Application: Electronic products, Automotive industries, Munitions, Telecommunications, Aerospace industries, and Intelligent control systems, testing equipments , consumption products , and power supply etc. | 具体详情请咨询我司 |
| SOT-523 | Features: 1. Small pattern package is to reduce PCB's layout space 2. General SMD packaging devicesn 3. Complies with IPC/JEDEC J-STD-033C MSD Level 3 4. UL Flammability Classification Rating 94V-0 5. Multiple performance options for different applications Application: Electronic products, Automotive industries, Munitions, Telecommunications, Aerospace industries, and Intelligent control systems, testing equipments , consumption products , and power supply etc. | 具体详情请咨询我司 |
